Buy Electromechanicals is the ultimate procurement destination for components that are thoroughly vetted for fit, form, and function. We appreciate your interest in part number 342100F00000G, an in-stock Boyd (Formerly Aavid) component we carry that is listed alongside the description “Boyd 342100f00000g - 101.6mm Length, 38.1mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications.” for identification and reference. By offering us important information such as your target price, expected shipping time frame, and more, we can best formulate and present a solution for part number 342100F00000G that caters to your unique needs and restrictions alike.
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To ensure that each Boyd (Formerly Aavid) product we sell is of the highest caliber, we enact rigorous quality assurance practices at every step of sourcing and fulfillment. Additionally, we understand that securing authentic Heat Sinks items is of the utmost importance, which is why we strictly follow a NO CHINA SOURCING policy. Moreover, with our AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation, you never have to worry about the caliber of your purchased components. Furthermore, our specialty is tailoring solutions to the requirements and limitations of our customers, and we can track down hard-to-find electromechanical parts with ease. With our various commitments in mind, kick off procurement for part number 342100F00000G and other Boyd 342100f00000g - 101.6mm Length, 38.1mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications. products today.
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